Product introduce

Equipment configuration of the production line: intelligent pressure plugging Via machine → automatic leveling machine →A intelligent solder resist screen printer → suspended tunnel oven →B intelligent solder resist screen printer → suspended tunnel oven

Full automatic thin plate solder resist production line: it is applicable to the solder resist ink printing production process of multiple material numbers, thin / thick circuit boards. It adopts well-known electrical hardware configuration at home and abroad, carries advanced design concepts, stable mechanical structure ratio, and is supported by a number of patented technologies. Ensure stable and reliable production and operation of products.

Product performance

CCD alignment system is adopted, and the material number is switched in 3-5min

Compatible with the production of 0.4mm-3.0mm plates

The production capacity reaches 3-6pnl / min

Realize [digitalization], [parameterization] and [intelligence]

Manipulator loading and unloading to realize the whole line online operation

hardware configuration

PLC: Mitsubishi guide rail: THK cylinder: AIRTAC communication: Mitsubishi

Touch screen: weinview synchronous belt: Megadyne bearing: NSK ball screw: TBI

technical parameter

Processing size processing thickness production efficiency

Maximum: 620mm * 720mm Maximum thickness: 3.0mm Maximum: 6pnl / min

Minimum: 400mm * 400mm Thinnest: 0.4mm Minimum: 3pnl / min